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Linewidth measurement aids process control
582
World Abstracts on Microelectronics and Reliability
dependent upon the topological layout of the links, their costs and reliabilities. Having the knowledge of the topological layout of the various computer centres (nodes) and maximum permissible cost of installing the various links at their pre-assigned positions; in this paper an algorithm for obtaining an optimal network topology which gives the maximum s -! reliability is presented. The developed method is general and is computerized. The proposed method has an additional advantage that the system is not to be redesigned, if at a later stage the permissible cost is enhanced by budgetary provisions. An example illustrates the algorithm.
Simplified algorithm for optimum availability allocation and redundancy optimization subject to cost constraint. K. K. GOVIL. Microelectron. Reliab. 24 (5) 935 (1984). A simplified algorithm is described for optimum availability allocation and redundancy optimization subject to cost constraint. A series reliability structure is considered and the problems of optimum availability allocation and redundancy optimization have been tackled separately. The algorithm basically involves the evaluation of selection factor di for the ith subsystem. The fixed cost increment or the redundant unit is assigned to that subsystem for which d~ is a maximum.
Stochastic models for evaluating probability of system failure due to human error. BALBIR S. DHILLON. Microelectron. Reliab. 24 (5) 921 (1984). This paper presents four mathematical models of redundant systems with human error. Laplace transforms of the state probability equations are developed. Mean time to failure (MTTF) formulas are developed.
Preventing maintenance induced failures. M|GUEL A, RAMIREZ. Proc. a. Reliab. Maintainab. Syrup. 138 (1985). This paper describes various types of maintenance induced failures, how and why these failures occur, and the features required to be implemented in the equipment so as to prevent or minimize maintenance induced failures from occurring. With knowledge of the field/test environment and the hardware design, the maintainability engineer can recommend/implement those features that best optimize the maintainability design of the equipment and at the same time result in minimal maintenance induced failures being created. Once these features are incorporated into the equipment, the number of maintenance induced failures caused by maintenance personnel is decreased.
Reliability evaluation of systems with crtitical human error. BALBIR S. DHILLON and R, B. M1SRA. Microelectron. Reliab. 24 (4) 743 (1984). This paper presents four mathematical models to evaluate reliability of redundant systems with critical human error. Equations for system reliability, state probabilities and mean time to failure are developed. System reliability and mean time to failure plots are shown. Policies for system-level diagnosis in a non-hierarchic distributed system. ROBERTONEGRIN1, MARIAGIOVANNASAMI and NELLO SCARABOTTOLO.IEEE Trans. Reliab. R-33 (4) 333 (October 1984). The paper presents a policy for system-level diagnosis and error confinement in distributed systems. The class of architectures to which the policy applies is defined, and the physical supports needed are described. It is proved that mechanisms presented permit reaching deterministic results of diagnosis in finite time (thus avoiding deadlock or starvation effects) and that system-level error confinement is effectively obtained. Mechanisms are implemented by means of software.
A problem with computerized systems. CLAUDE [:. VERAA. Proc. a. Reliab. Maintainab. Syrup. 150 (1985). An analysis of failures on a major computerized system revealed that the most prevalent failure category, during development stage testing, was a condition which became known as "reseating" problems. Such a problem is often encountered when a system failure occurs and ensuing diagnosis identifies the need for removal of a possible defective circuit card or module. However, sometimes, upon further testing, no defect can be found in the circuit card and apparent system operation is fully restored by simply removing and reseating the card or module. This paper analyzes the probable failure causes, involving both software and hardware, which lead to reseating problems.
4. M I C R O E L E C T R O N I C S - - G E N E R A L Semiconductor research: an industry-university venture. CHUCK MURRAY. Semiconductor Int. 176 (May 1985). Industry-university affiliations for research are an investment in future manpower as well as technology development. Materials measurements: present abilities and future needs. ROBERT I. SCACE. Solid St. Technol. 155 (March 1985). Standard measurement methods and specifications for the semiconductor industry are reviewed and discussed with emphasis on applications to VLSI processes. The standards development process is an excellent way for material producers and users to develop good working relations and
to solve their shared measurement problems; this process is described in some detail. Because the semiconductor industry is an international one, serious efforts have been made for a number of years to rationalize the technical differences between test method standards in Europe and the U.S. with considerable success. The present state of such cooperative activity with Japan, which is of more recent origin, is also reported. MOS meets radiation challenge. CARL GUSERTand KENNETH A. MARKS. Electronics Week, 89 (1 January 1985). Newgeneration MOS chips have geometries and processing techniques that stand up to X and gamma rays.
5. M I C R O E L E C T R O N I C S - - D E S I G N AND C O N S T R U C T I O N A two micron metal interconnect process over severe topography. F. C. CHXEN, R. L. BROWN, G. N. BURTON and M. B. VORA. Semiconductor Int. 78 (March 1985). A method of producing 2#m metal lines contacting a rough double poly structure incorporates a planarization procedure that improves the structure for subsequent interconnect processes. Linewidth measurement aids process control. PETER H. SINGER. Semiconductor Int. 66 (February 1985).
Measurements of critical geometries on wafers in process can be correlated to key processing parameters, providing an efficient means of process control. A review of nitrogen trifluoride for dry etching in microelectronics processing. BOGDAN GOLJA, JOHN A. BARKANIC and ANDREW HOFF. Microelectron. J. 16 (1) 5 (1985). The development of new gases for dry etching is important if submicron device geometries are to be realized. Gases which are currently in use for the various processing
World Abstracts on Microelectronics and Reliability
dependent upon the topological layout of the links, their costs and reliabilities. Having the knowledge of the topological layout of the various computer centres (nodes) and maximum permissible cost of installing the various links at their pre-assigned positions; in this paper an algorithm for obtaining an optimal network topology which gives the maximum s -! reliability is presented. The developed method is general and is computerized. The proposed method has an additional advantage that the system is not to be redesigned, if at a later stage the permissible cost is enhanced by budgetary provisions. An example illustrates the algorithm.
Simplified algorithm for optimum availability allocation and redundancy optimization subject to cost constraint. K. K. GOVIL. Microelectron. Reliab. 24 (5) 935 (1984). A simplified algorithm is described for optimum availability allocation and redundancy optimization subject to cost constraint. A series reliability structure is considered and the problems of optimum availability allocation and redundancy optimization have been tackled separately. The algorithm basically involves the evaluation of selection factor di for the ith subsystem. The fixed cost increment or the redundant unit is assigned to that subsystem for which d~ is a maximum.
Stochastic models for evaluating probability of system failure due to human error. BALBIR S. DHILLON. Microelectron. Reliab. 24 (5) 921 (1984). This paper presents four mathematical models of redundant systems with human error. Laplace transforms of the state probability equations are developed. Mean time to failure (MTTF) formulas are developed.
Preventing maintenance induced failures. M|GUEL A, RAMIREZ. Proc. a. Reliab. Maintainab. Syrup. 138 (1985). This paper describes various types of maintenance induced failures, how and why these failures occur, and the features required to be implemented in the equipment so as to prevent or minimize maintenance induced failures from occurring. With knowledge of the field/test environment and the hardware design, the maintainability engineer can recommend/implement those features that best optimize the maintainability design of the equipment and at the same time result in minimal maintenance induced failures being created. Once these features are incorporated into the equipment, the number of maintenance induced failures caused by maintenance personnel is decreased.
Reliability evaluation of systems with crtitical human error. BALBIR S. DHILLON and R, B. M1SRA. Microelectron. Reliab. 24 (4) 743 (1984). This paper presents four mathematical models to evaluate reliability of redundant systems with critical human error. Equations for system reliability, state probabilities and mean time to failure are developed. System reliability and mean time to failure plots are shown. Policies for system-level diagnosis in a non-hierarchic distributed system. ROBERTONEGRIN1, MARIAGIOVANNASAMI and NELLO SCARABOTTOLO.IEEE Trans. Reliab. R-33 (4) 333 (October 1984). The paper presents a policy for system-level diagnosis and error confinement in distributed systems. The class of architectures to which the policy applies is defined, and the physical supports needed are described. It is proved that mechanisms presented permit reaching deterministic results of diagnosis in finite time (thus avoiding deadlock or starvation effects) and that system-level error confinement is effectively obtained. Mechanisms are implemented by means of software.
A problem with computerized systems. CLAUDE [:. VERAA. Proc. a. Reliab. Maintainab. Syrup. 150 (1985). An analysis of failures on a major computerized system revealed that the most prevalent failure category, during development stage testing, was a condition which became known as "reseating" problems. Such a problem is often encountered when a system failure occurs and ensuing diagnosis identifies the need for removal of a possible defective circuit card or module. However, sometimes, upon further testing, no defect can be found in the circuit card and apparent system operation is fully restored by simply removing and reseating the card or module. This paper analyzes the probable failure causes, involving both software and hardware, which lead to reseating problems.
4. M I C R O E L E C T R O N I C S - - G E N E R A L Semiconductor research: an industry-university venture. CHUCK MURRAY. Semiconductor Int. 176 (May 1985). Industry-university affiliations for research are an investment in future manpower as well as technology development. Materials measurements: present abilities and future needs. ROBERT I. SCACE. Solid St. Technol. 155 (March 1985). Standard measurement methods and specifications for the semiconductor industry are reviewed and discussed with emphasis on applications to VLSI processes. The standards development process is an excellent way for material producers and users to develop good working relations and
to solve their shared measurement problems; this process is described in some detail. Because the semiconductor industry is an international one, serious efforts have been made for a number of years to rationalize the technical differences between test method standards in Europe and the U.S. with considerable success. The present state of such cooperative activity with Japan, which is of more recent origin, is also reported. MOS meets radiation challenge. CARL GUSERTand KENNETH A. MARKS. Electronics Week, 89 (1 January 1985). Newgeneration MOS chips have geometries and processing techniques that stand up to X and gamma rays.
5. M I C R O E L E C T R O N I C S - - D E S I G N AND C O N S T R U C T I O N A two micron metal interconnect process over severe topography. F. C. CHXEN, R. L. BROWN, G. N. BURTON and M. B. VORA. Semiconductor Int. 78 (March 1985). A method of producing 2#m metal lines contacting a rough double poly structure incorporates a planarization procedure that improves the structure for subsequent interconnect processes. Linewidth measurement aids process control. PETER H. SINGER. Semiconductor Int. 66 (February 1985).
Measurements of critical geometries on wafers in process can be correlated to key processing parameters, providing an efficient means of process control. A review of nitrogen trifluoride for dry etching in microelectronics processing. BOGDAN GOLJA, JOHN A. BARKANIC and ANDREW HOFF. Microelectron. J. 16 (1) 5 (1985). The development of new gases for dry etching is important if submicron device geometries are to be realized. Gases which are currently in use for the various processing