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Oxide isolation builds a better Schottky TTL
World Abstracts on Microelectronics and Reliability what has been achieved in practice, and the article describes the JPL-Star computer. This is an experimental computer designed to evaluate many of the strategies for enhancing fault-tolerance, and it is already obsolete. This article concludes, therefore, with a brief survey of other fault-tolerant proposals and implementations. Graphical procedure for the easy execution of double three class attributes sampling plans: Uncurtailed as well as curtailed. D. K. SHAH and A. G. PHATAK.QR J. India p. 111 (September 1978). Inspectors experience difficulties in execution of attributes sampling plans depending on the plans like multiple, three class, curtailed and uncurtailed. This paper describes the evolution and application of a simplified graphical procedure to illustrate the execution of double three class attributes sampling plans curtailed as well as uncurtailed.
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Designing a serviceman's needs into microprocessor-based systems. MARTIN NEIL and RANDY GOODNER. Electronics p. 122 (1 March 1979). Mapping tells him where to start; signature analysis locates circuit nodes in trouble; diagnostics check operation. Reliability assurance program of TESLA Communications Transmission Systems. PETR BROZ. TESLA Electronics 4/1978, 99. A complex reliability assurance program is described using an example of TESLA KNK 12 carrier equipment and the related primary translating racks. Apart from the calculation of reliability, this program is designed to check various types of component parts and their application ; it also enables quality and reliability tests to be carried out at all stages of production, including testing and burning-in. In conclusion, some special methods are discussed enabling the attained operational reliability to be observed in operation.
4. M I C R O E L E C T RO N ICS--G E N E RA L Integrated optical spectrum analyzer: an imminent "chip". DEAN B. ANDERSON. IEEE Spectrum p. 22 (December 1978). Integrated optics may be thought of as a kind of second-generation optical fiber telecommunications. The first generation, rapidly coming to the fore, employs multimode fibers and electroluminescent diodes, with opticalsignal conversion to and control at the electronic level. The evolving field of integrated optics combines singlemode fibers with laser diodes to increase information-
handling capacity, with the expectation of control at the optical level. Devices meeting focuses on VLSI, GaAs, and sensors. RAY CAPECE and NICOLAS MOKHOEE. Electronics p. 129 (7 December 1978). This year IEDM's papers explore gallium arsenide's advantages over silicon and the best routes to l-micrometer geometries.
5. MICROELECTRONICS DESIGN AND CONSTRUCTION Oxide isolation builds a better Schottky TTL. BOB BECHDOLT, DAVE FERRIS and PAUL GRIFFITH. Electronics p. 111 (1 March 1979). Three-stage low-capacitance circuit blends low power consumption with fast operation.
time between the two consecutive pulses. The delay is related to the behavior of transient drain current and attributed to the large concentration of traps at the silicon sapphire interface.
A new electroless method for low-loss microwave integrated circuits. S. MAHAPATRAand S. N. PRASAD. IEEE Trans. Components, Hybrids, MJ9 Technol. Chmt.-l, (4) 428 (December 1978). A new method of depositing copper on alumina substrates is described. This results in less attenuation and better adhesion than that obtained by the prior method. The measured attenuation of microstriplines made by conventional vacuum evaporation of chrome gold and by electroless copper deposition methods is compared in the range of 2-10 GHz. It is found that classical chrome gold metallization gives higher attenuation. The experimental data for this new method are in good agreement with the theoretically predicted values. The superiority of the new method over the prior methods is discussed.
Design forethought promotes easier testing of microcomputer boards. MICHAEL D. LIPPMAN and EDWARD S. DONN. Eh'ctronics p. l l 3 (18 January 1979). Three key considerations are: using microcomputers' self-test capabilities, adopting new diagnostic algorithms, and designing the system for testability.
Two chips, two processes combine in per-channel coderdecoder. JAMES W. SMITH. Electronics p. 126 (1 February 1979). Codec takes advantage of each technology's strengths in its bi-FET linear and C-MOS digital chips. Frequency dependent propagation delay in silicon-on-sapphire digital integrated circuits. S. SHEFFIELD EATON and B LALEVIC. SoBd-St. Electron. 21, 1253 (1978). A frequency dependent propagation delay was observed in a silicon-onsapphire (SOS) counter circuit. It is found that this delay is a function of temperature, supply voltage and the "off"
C-MOS on sapphire sparks small computer's performance. JAKE JACOBS. Electronics p. 108 (1 February 1979). Functionally partitioned three-chip CPU resolves architectural challenge, packs big machine power into a small package. Contributions to the design of highly integrated MOS circuits. K. H. DIENER el al. Nachrichtentechnik Elektronik 29, (2) 57 (1979). (In German.) The design of highly integrated MOS circuits is a rather complex problem from an engineering point of view, and, inter alia, may be divided into subjects as follows: modelling, component and circuit design, design of layout, as well as modelling and simulation. The present paper reviews some results obtained in this respect, and which are illustrated by several examples. C-MOS op amp offsets errors with continuous sampling technique. Electronics p. 39 (18 January 1979). Within frequency limits of dc to 10 Hz, new design has maximum input offset voltage of + 5 microvolts.
309
Designing a serviceman's needs into microprocessor-based systems. MARTIN NEIL and RANDY GOODNER. Electronics p. 122 (1 March 1979). Mapping tells him where to start; signature analysis locates circuit nodes in trouble; diagnostics check operation. Reliability assurance program of TESLA Communications Transmission Systems. PETR BROZ. TESLA Electronics 4/1978, 99. A complex reliability assurance program is described using an example of TESLA KNK 12 carrier equipment and the related primary translating racks. Apart from the calculation of reliability, this program is designed to check various types of component parts and their application ; it also enables quality and reliability tests to be carried out at all stages of production, including testing and burning-in. In conclusion, some special methods are discussed enabling the attained operational reliability to be observed in operation.
4. M I C R O E L E C T RO N ICS--G E N E RA L Integrated optical spectrum analyzer: an imminent "chip". DEAN B. ANDERSON. IEEE Spectrum p. 22 (December 1978). Integrated optics may be thought of as a kind of second-generation optical fiber telecommunications. The first generation, rapidly coming to the fore, employs multimode fibers and electroluminescent diodes, with opticalsignal conversion to and control at the electronic level. The evolving field of integrated optics combines singlemode fibers with laser diodes to increase information-
handling capacity, with the expectation of control at the optical level. Devices meeting focuses on VLSI, GaAs, and sensors. RAY CAPECE and NICOLAS MOKHOEE. Electronics p. 129 (7 December 1978). This year IEDM's papers explore gallium arsenide's advantages over silicon and the best routes to l-micrometer geometries.
5. MICROELECTRONICS DESIGN AND CONSTRUCTION Oxide isolation builds a better Schottky TTL. BOB BECHDOLT, DAVE FERRIS and PAUL GRIFFITH. Electronics p. 111 (1 March 1979). Three-stage low-capacitance circuit blends low power consumption with fast operation.
time between the two consecutive pulses. The delay is related to the behavior of transient drain current and attributed to the large concentration of traps at the silicon sapphire interface.
A new electroless method for low-loss microwave integrated circuits. S. MAHAPATRAand S. N. PRASAD. IEEE Trans. Components, Hybrids, MJ9 Technol. Chmt.-l, (4) 428 (December 1978). A new method of depositing copper on alumina substrates is described. This results in less attenuation and better adhesion than that obtained by the prior method. The measured attenuation of microstriplines made by conventional vacuum evaporation of chrome gold and by electroless copper deposition methods is compared in the range of 2-10 GHz. It is found that classical chrome gold metallization gives higher attenuation. The experimental data for this new method are in good agreement with the theoretically predicted values. The superiority of the new method over the prior methods is discussed.
Design forethought promotes easier testing of microcomputer boards. MICHAEL D. LIPPMAN and EDWARD S. DONN. Eh'ctronics p. l l 3 (18 January 1979). Three key considerations are: using microcomputers' self-test capabilities, adopting new diagnostic algorithms, and designing the system for testability.
Two chips, two processes combine in per-channel coderdecoder. JAMES W. SMITH. Electronics p. 126 (1 February 1979). Codec takes advantage of each technology's strengths in its bi-FET linear and C-MOS digital chips. Frequency dependent propagation delay in silicon-on-sapphire digital integrated circuits. S. SHEFFIELD EATON and B LALEVIC. SoBd-St. Electron. 21, 1253 (1978). A frequency dependent propagation delay was observed in a silicon-onsapphire (SOS) counter circuit. It is found that this delay is a function of temperature, supply voltage and the "off"
C-MOS on sapphire sparks small computer's performance. JAKE JACOBS. Electronics p. 108 (1 February 1979). Functionally partitioned three-chip CPU resolves architectural challenge, packs big machine power into a small package. Contributions to the design of highly integrated MOS circuits. K. H. DIENER el al. Nachrichtentechnik Elektronik 29, (2) 57 (1979). (In German.) The design of highly integrated MOS circuits is a rather complex problem from an engineering point of view, and, inter alia, may be divided into subjects as follows: modelling, component and circuit design, design of layout, as well as modelling and simulation. The present paper reviews some results obtained in this respect, and which are illustrated by several examples. C-MOS op amp offsets errors with continuous sampling technique. Electronics p. 39 (18 January 1979). Within frequency limits of dc to 10 Hz, new design has maximum input offset voltage of + 5 microvolts.