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VLSI technology
Microelectron.Reliab., Vol. 27, No. 5, pp. 933
943, 1987.
Pergamon Journals Ltd.
Printed in Great Britain.
WORLD ABSTRACTS ON MICROELECTRONICS A N D RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. The are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects 1. Reliability-- General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. 4. Microelectronics General. 5. Microelectronics Design and Construction. 6. Microelectronics--Components, Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials. 9. Electron, Ion and Laser Beam Techniques.
1. R E L I A B I L I T Y - - G E N E R A L
Quality control of surfaces for high-reliability electronics. B. N. ELLIS. Circuit Wld 13 (2), 28 (1987). This paper discusses the requirements of quality assurance of electronics assemblies with respect to the surface conditions, and more particularly the problems introduced by modern assembly techniques. Ionic contamination testing and surface insulation resistance measurement are dealt with as complementary techniques. Particular emphasis is laid on the fact that standards related to both QC methods are inadequate and do not reflect modern needs. Cleaning, as a corollary to contamination, is touched upon without detail, other than a table comparing methods as a function of purchasing and operating costs, technical performance, etc.
(1987). Military electronic systems of increasing reliability, lower maintenance cost (or cost of ownership), and improved performance have become "necessities" rather than requirements. The ever-increasing use of VHSIC/VLSI technology however is making these "necessities" into realities by replacement of discrete components and large ICs through various DuD circuit insertion programs. The small size of VLSI devices is not just an end in itself, but is related to lower cost, higher yield, higher reliability potential, and possible elimination of certain maintenance tasks. This explains why DuD is interested in inserting VHSIC/VLSI technology into the active inventory in the FY 86-88 time frame. This paper will address reliability, maintainability, and testability. Discussed are routine avionic equipment failures and their causes and how VHSIC/VLSI can improve the area of reliability, with maintainability/testability as a boot-strap item to this discipline. Further, a graphic illustration will be presented on how mean time to repair (MTTR) has decreased while mean time between failures (MTBF) has increased during the evolution of circuit technology over the past few years.
Recipe for reliability: shake and bake. WAYNE TUSTIN. IEEE Spectrum, 37 (December 1986). Environmental stress screening (ESS), a military convention, is moving into other markets as an inexpensive way to improve product reliability and identify design flaws. Progress in quality and design. K. K. SCHWARZ. Electron. Power, 133 (February 1987). In a discussion of quality and design, the fourth article in our series on design looks at progress of engineering manufacture in the field of heavy engineering. Modeling the penalty costs of software failure. MICHAEL FRIEDMAN. Proc. a. Reliab. Maintainab. Symp., 359 (1987). A new software reliability modeling technique is described that takes into account the penalty costs (quantification of undesired consequences) of software failure. The technique is based on the theory of compound stochastic processes. The failure rate formulation can be borrowed from any number of existing time-domain software reliability models.
R. & M attributes of VHSIC/VLSI technology. ELAINE ZINS and GEORGE SMITH. Proc. a. Reliab. Maintainab. Symp., 403
2. R E L I A B I L I T Y
Human engineering and software maintainability effects on software reliability. MARK D. HANSEN. Proc. a. Reliab. Maintainab. Symp., 374 (1987). This paper addresses the issue of software maintainability and application of human engineering to the improvement of software reliability/maintainability. The methodology stipulated revolves around the standardization of the software programmer coding methods which impact the software maintainer interface to the source code. The results include the facilitation of the software maintainer interface by consistent application of software coding standards. A byproduct of using this methodology is the inherent improvement in system performance, software reliability/maintainability.
OF COMPONENTS,
TUBES,
The use of computer aids in IC technology evolution. ROBERT W. DUTTON and MARK R. PINTO. Proc. IEEE 74, 1730 (1986). Computer-aided analysis of integrated circuit devices has played a critical role for more than three decades of technology evolution. In the 1950s and early 1960s MR .-,7i~-J
933
TRANSISTORS
AND
ICs
simulation was used extensively to characterize the operating principles of both bipolar and MOS devices. Bipolar effects such as base-width modulation and base pushout were characterized as well as MOS phenomena includinggradual channel and channel-length modulation effects. During the
943, 1987.
Pergamon Journals Ltd.
Printed in Great Britain.
WORLD ABSTRACTS ON MICROELECTRONICS A N D RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. The are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects 1. Reliability-- General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. 4. Microelectronics General. 5. Microelectronics Design and Construction. 6. Microelectronics--Components, Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials. 9. Electron, Ion and Laser Beam Techniques.
1. R E L I A B I L I T Y - - G E N E R A L
Quality control of surfaces for high-reliability electronics. B. N. ELLIS. Circuit Wld 13 (2), 28 (1987). This paper discusses the requirements of quality assurance of electronics assemblies with respect to the surface conditions, and more particularly the problems introduced by modern assembly techniques. Ionic contamination testing and surface insulation resistance measurement are dealt with as complementary techniques. Particular emphasis is laid on the fact that standards related to both QC methods are inadequate and do not reflect modern needs. Cleaning, as a corollary to contamination, is touched upon without detail, other than a table comparing methods as a function of purchasing and operating costs, technical performance, etc.
(1987). Military electronic systems of increasing reliability, lower maintenance cost (or cost of ownership), and improved performance have become "necessities" rather than requirements. The ever-increasing use of VHSIC/VLSI technology however is making these "necessities" into realities by replacement of discrete components and large ICs through various DuD circuit insertion programs. The small size of VLSI devices is not just an end in itself, but is related to lower cost, higher yield, higher reliability potential, and possible elimination of certain maintenance tasks. This explains why DuD is interested in inserting VHSIC/VLSI technology into the active inventory in the FY 86-88 time frame. This paper will address reliability, maintainability, and testability. Discussed are routine avionic equipment failures and their causes and how VHSIC/VLSI can improve the area of reliability, with maintainability/testability as a boot-strap item to this discipline. Further, a graphic illustration will be presented on how mean time to repair (MTTR) has decreased while mean time between failures (MTBF) has increased during the evolution of circuit technology over the past few years.
Recipe for reliability: shake and bake. WAYNE TUSTIN. IEEE Spectrum, 37 (December 1986). Environmental stress screening (ESS), a military convention, is moving into other markets as an inexpensive way to improve product reliability and identify design flaws. Progress in quality and design. K. K. SCHWARZ. Electron. Power, 133 (February 1987). In a discussion of quality and design, the fourth article in our series on design looks at progress of engineering manufacture in the field of heavy engineering. Modeling the penalty costs of software failure. MICHAEL FRIEDMAN. Proc. a. Reliab. Maintainab. Symp., 359 (1987). A new software reliability modeling technique is described that takes into account the penalty costs (quantification of undesired consequences) of software failure. The technique is based on the theory of compound stochastic processes. The failure rate formulation can be borrowed from any number of existing time-domain software reliability models.
R. & M attributes of VHSIC/VLSI technology. ELAINE ZINS and GEORGE SMITH. Proc. a. Reliab. Maintainab. Symp., 403
2. R E L I A B I L I T Y
Human engineering and software maintainability effects on software reliability. MARK D. HANSEN. Proc. a. Reliab. Maintainab. Symp., 374 (1987). This paper addresses the issue of software maintainability and application of human engineering to the improvement of software reliability/maintainability. The methodology stipulated revolves around the standardization of the software programmer coding methods which impact the software maintainer interface to the source code. The results include the facilitation of the software maintainer interface by consistent application of software coding standards. A byproduct of using this methodology is the inherent improvement in system performance, software reliability/maintainability.
OF COMPONENTS,
TUBES,
The use of computer aids in IC technology evolution. ROBERT W. DUTTON and MARK R. PINTO. Proc. IEEE 74, 1730 (1986). Computer-aided analysis of integrated circuit devices has played a critical role for more than three decades of technology evolution. In the 1950s and early 1960s MR .-,7i~-J
933
TRANSISTORS
AND
ICs
simulation was used extensively to characterize the operating principles of both bipolar and MOS devices. Bipolar effects such as base-width modulation and base pushout were characterized as well as MOS phenomena includinggradual channel and channel-length modulation effects. During the