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Process for preparing solderable integrated circuit lead frames
PATENTS GRANTED In the Metal Finishing Field f’rinted copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 2023 1.
Nondestructive Testing
Adhesion
Reducing Lead Leachate in Brass Plumbing Components
U.S. Patent .5,454,260.Oct. 3, 1995 Y Wang, assignor to Genera/ Motors Corp., Detroit
A process for determining acceptable adhesion of a coating to a substrate, comprising preparing a reference standard by depositing a coating onto a reference sub\trate such that the coating adheres with a minimum acceptable strength; directing a supersonic jet of water from a nozzle against one site on the reference coating; varying the impingement intensity jet until d failure is ascertained; parading a plurality of coated substrates having the coating to be evaluated through a supersonic sreening jet of water emanating from an evaluation nozzle; and separating those coated sub\trates whose coatings debond from the substrate from those that adhere to the substrate when subjected to the screening jet.
Coated Abrasive U.S. Patent 5,454,750.Oct. 3, 1995 R.J. Cosmano and E.J. Dwell, assignors to 3M Co., St. Paul, Minn.
A coated abrasive article comprising a backing and adhered to at least one major surface of the backing a multiplicity of erodable agglomerates and a multiplicity of abrasive grains.
Abrasive
Article
U.S. Patent 5,454,844.Oct. 3, 1995 L.D. Hibbard et al., assignors to 3M Co., St. Paul, Minn.
An abrasive article comprising a sheerlike structure having a major surface and having deployed in a fixed position thereon a plurality of abutting abrasive composites in an area spacing of at least 1,200 composites/cm’, each composite comprising a plurality of abrasive particles dispersed in a binder.
Powder Coating
System
U.S. Patent 5454,872. Oct. 3, 1995 H.J. Ladar et al., assignors to Nordson Corp., Westlake, Ohio
A system for controlling and utilizing finer powder particles in a powder coating operation. METAL FINISHING
. JUNE
1996
U.S. Patent 5,454,876. Oct. 3, 1995 J.P Downey, assignor to 21sf Century Companies Inc., Ty/er, Texas A process for treating brass components to reduce leachable lead when the component is subsequently exposed to water, the process including exposing to an aqueous solution containing chloride in a concentration of 0.17 to 2. I M and pyrophosphate in a concentration of 0.06 M to 0.27 M; the brass component remaining exposed for 3.5 to 30 min at 35 to 70°C.
Process for Controlling Conversion Coating of Aluminum U.S. Patent 5,454,882. Ocf. 3, 1995 Y Asai et al., assignors to Her&e/ Corp., Plymouth Meeting, Pa.
A method for controlling the conversion coating activity, for aluminum or aluminum alloy, of a conversion coating solution containing fluoride ions and having a pH below 4, comprising determining a desired range for effective fluorine concentration (EFC); potentiometrically titrating the sample of the conversion coating solution. without pH adjustment, using a fluoride ion electrode as the indicator electrode, and using as the titrant an aqueous solution containing ions selected from the group consisting of aluminum, lanthanum, yttrium, zirconium, gallium, cerium, and beryllium ions. to an inflection point on a potential curve for the fluoride ion electrode; determining the EFC of the solution from the quantity of titrant addition and, when the EFC is less than the minimum of the desirable range, adding a source of fluoride ions to the conversion coating solution.
Apparatus and Process Recovering Metal
for
U.S. Patent 5,454,917. Oct. 3, 1995 PL. Maftison et al., assignors to Cognis Inc., Santa Rosa, Calif.
An apparatus for recovering metal from an aqueous solution, which comprises a metal recovery assembly comprising an anode with a plurality of bars of a reducing
metal having a more negative standard state reduction potential than the metal to be recovered and having an area to volume ratio not greater than about 422 m’/m3, arranged adjacent to and in electrical communication with a cathode comprising a high surface area electroconductive material having a more positive standard state reduction potential than the reducing metal.
Electroformed
Copper Foil
U.S. Patent 5,454,926. Oct. 3, 1995 S.J. Clouser et a/., assignors to Gould Hectronics Inc., Eastlake, Ohio
An electrodeposited copper foil having an elongation measured at I8O”C in excess of 5.S%, an ultimate tensile strength measured at 180°C in excess of 25,000 psi, and an ultimate tensile strength measured at 23°C in excess of 66,000 psi.
Process for Preparing Solderable Integrated Circuit Lead Frames U.S. Patent 5,454,929. Oct. 3, 1995 D.H. Klinghom, assignor to National Semiconductor Corp., Santa Clara, Calif.
A process for preparing a solderable lead frame having a multiplicity of leads, comprising tin plating on a base lead frame made to deposit tin on the external region while leaving the internal region unplated; and palladium plating a portion or all of the base lead frame after tin plating whereby the external region coated with tin and at least a portion of the unplated internal region are coated with palladium.
Electrolytic Copper Plating Using a Reducing Agent U.S. Patent 5,454,930. Oct. 3, 7995 T. Miura and M. Seita, assignors to LeaRonal Japan Inc., Tokyo
An electrolytic copper plating method using a reducing agent, comprising dipping a catalyzed, electrically nonconductive substrate in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition, selected from the group consisting of dimethylamineborane, a hydrazine and its salts, hypophosphorous acid and its salts, and is present at a concentration of 5 to 20 g/L, 155
Nondestructive Testing
Adhesion
Reducing Lead Leachate in Brass Plumbing Components
U.S. Patent .5,454,260.Oct. 3, 1995 Y Wang, assignor to Genera/ Motors Corp., Detroit
A process for determining acceptable adhesion of a coating to a substrate, comprising preparing a reference standard by depositing a coating onto a reference sub\trate such that the coating adheres with a minimum acceptable strength; directing a supersonic jet of water from a nozzle against one site on the reference coating; varying the impingement intensity jet until d failure is ascertained; parading a plurality of coated substrates having the coating to be evaluated through a supersonic sreening jet of water emanating from an evaluation nozzle; and separating those coated sub\trates whose coatings debond from the substrate from those that adhere to the substrate when subjected to the screening jet.
Coated Abrasive U.S. Patent 5,454,750.Oct. 3, 1995 R.J. Cosmano and E.J. Dwell, assignors to 3M Co., St. Paul, Minn.
A coated abrasive article comprising a backing and adhered to at least one major surface of the backing a multiplicity of erodable agglomerates and a multiplicity of abrasive grains.
Abrasive
Article
U.S. Patent 5,454,844.Oct. 3, 1995 L.D. Hibbard et al., assignors to 3M Co., St. Paul, Minn.
An abrasive article comprising a sheerlike structure having a major surface and having deployed in a fixed position thereon a plurality of abutting abrasive composites in an area spacing of at least 1,200 composites/cm’, each composite comprising a plurality of abrasive particles dispersed in a binder.
Powder Coating
System
U.S. Patent 5454,872. Oct. 3, 1995 H.J. Ladar et al., assignors to Nordson Corp., Westlake, Ohio
A system for controlling and utilizing finer powder particles in a powder coating operation. METAL FINISHING
. JUNE
1996
U.S. Patent 5,454,876. Oct. 3, 1995 J.P Downey, assignor to 21sf Century Companies Inc., Ty/er, Texas A process for treating brass components to reduce leachable lead when the component is subsequently exposed to water, the process including exposing to an aqueous solution containing chloride in a concentration of 0.17 to 2. I M and pyrophosphate in a concentration of 0.06 M to 0.27 M; the brass component remaining exposed for 3.5 to 30 min at 35 to 70°C.
Process for Controlling Conversion Coating of Aluminum U.S. Patent 5,454,882. Ocf. 3, 1995 Y Asai et al., assignors to Her&e/ Corp., Plymouth Meeting, Pa.
A method for controlling the conversion coating activity, for aluminum or aluminum alloy, of a conversion coating solution containing fluoride ions and having a pH below 4, comprising determining a desired range for effective fluorine concentration (EFC); potentiometrically titrating the sample of the conversion coating solution. without pH adjustment, using a fluoride ion electrode as the indicator electrode, and using as the titrant an aqueous solution containing ions selected from the group consisting of aluminum, lanthanum, yttrium, zirconium, gallium, cerium, and beryllium ions. to an inflection point on a potential curve for the fluoride ion electrode; determining the EFC of the solution from the quantity of titrant addition and, when the EFC is less than the minimum of the desirable range, adding a source of fluoride ions to the conversion coating solution.
Apparatus and Process Recovering Metal
for
U.S. Patent 5,454,917. Oct. 3, 1995 PL. Maftison et al., assignors to Cognis Inc., Santa Rosa, Calif.
An apparatus for recovering metal from an aqueous solution, which comprises a metal recovery assembly comprising an anode with a plurality of bars of a reducing
metal having a more negative standard state reduction potential than the metal to be recovered and having an area to volume ratio not greater than about 422 m’/m3, arranged adjacent to and in electrical communication with a cathode comprising a high surface area electroconductive material having a more positive standard state reduction potential than the reducing metal.
Electroformed
Copper Foil
U.S. Patent 5,454,926. Oct. 3, 1995 S.J. Clouser et a/., assignors to Gould Hectronics Inc., Eastlake, Ohio
An electrodeposited copper foil having an elongation measured at I8O”C in excess of 5.S%, an ultimate tensile strength measured at 180°C in excess of 25,000 psi, and an ultimate tensile strength measured at 23°C in excess of 66,000 psi.
Process for Preparing Solderable Integrated Circuit Lead Frames U.S. Patent 5,454,929. Oct. 3, 1995 D.H. Klinghom, assignor to National Semiconductor Corp., Santa Clara, Calif.
A process for preparing a solderable lead frame having a multiplicity of leads, comprising tin plating on a base lead frame made to deposit tin on the external region while leaving the internal region unplated; and palladium plating a portion or all of the base lead frame after tin plating whereby the external region coated with tin and at least a portion of the unplated internal region are coated with palladium.
Electrolytic Copper Plating Using a Reducing Agent U.S. Patent 5,454,930. Oct. 3, 7995 T. Miura and M. Seita, assignors to LeaRonal Japan Inc., Tokyo
An electrolytic copper plating method using a reducing agent, comprising dipping a catalyzed, electrically nonconductive substrate in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition, selected from the group consisting of dimethylamineborane, a hydrazine and its salts, hypophosphorous acid and its salts, and is present at a concentration of 5 to 20 g/L, 155